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PRODUCT DESCRIPTION : Intel Thermal Solution STS100C TYPE : Passive/active combination heat sink with removable fan MAXIMUM CPU TDP : 130W SUITABLE FOR : Intel Xeon processors in server/workstation systems featuring two LGA1366 sockets RECOMMENDED USAGE With fan installed : Pedestal chassis that provides adequate ventilation and correct temperature air to heat sink With fan removed : Pedestal chassis with ducted airflow to heat sink 2U or larger rack chassis2 with ducted airflow to heat sink
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