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|PRODUCT DESCRIPTION : Intel Thermal Solution STS100C|
TYPE : Passive/active combination heat sink with removable
MAXIMUM CPU TDP : 130W
SUITABLE FOR : Intel Xeon processors in server/workstation systems
featuring two LGA1366 sockets
With fan installed : Pedestal chassis that provides adequate ventilation
and correct temperature air to heat sink
With fan removed : Pedestal chassis with ducted airflow to heat sink
2U or larger rack chassis2 with ducted airflow to
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